Gaya APA

harman, G. (1997). wire bonding in microelectronics materials, processes reliability and yield (^a2 ^bjilid 1). USA: McGraw-Hill Book Company.

Gaya MLA

harman, Gerge. "wire bonding in microelectronics materials, processes reliability and yield". ^a2 ^bjilid 1 USA: McGraw-Hill Book Company, 1997. Text.